Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules

Product Details
Customization: Available
Application: Electronic Devices, Power Supply, Semiconductors
Conductive Layer: Customizable
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  • Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
  • Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
  • Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
  • Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
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  • Overview
  • Product Description
  • Our Factory
  • Packing & Delivery
  • FAQ
Overview

Basic Info.

Model NO.
Aluminum nitride ceramic coated substrate
Material
AlN
Process
Customizable
Thickness
Customizable
Density
3.3G/Cm³
Warpage
≤200um
Solder Wettability
≥95%
Flexural Strength
≥350MPa
Thermal Conductivity
≥170W/M K
Coefficient of Thermal Expansion
4.7(20~ 300ºC)10-6/K
Dielectric Loss
0.0005MHz
Dielectric Constant
9MHz
Dielectric Strength
≥20kv/mm
Resistivity
10^14Ω.Cm
Aperture
120-160µm
Aperture Pitch
≥0.2mm
Au Layer Thickness
0.01-0.2 μm
Ni Layer Thickness
2-10 μm
AG Layer Thickness
0.03-1.0 μm
Transport Package
Wooden Box
Specification
Customizable
Trademark
OEM/ODM
Origin
China

Product Description

Product Description
Aluminum Nitride Ceramic AMB Copper-Clad Substrate
Its high thermal conductivity of 160 to 180 W/m·K makes it ideal for heat dissipation applications. Its coefficient of thermal expansion is well matched to silicon, making it useful in electronic packaging and semiconductor substrates. Its high volume resistivity and high dielectric withstand voltage make it widely used in high-voltage equipment and power systems. Its high wear resistance and excellent chemical stability make it suitable for components requiring long-term durability. Its high resistivity and low dielectric loss make it an ideal electrical insulation material.
Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
Applied Area
- Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control   Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors 
- Home Appliance: Air Conditioner, Peltier Cooler 
- Industrial: LED Displays, Welding Machine
- Aerospace: Laser, Power Supply for Satellites and Aircrafts 
- Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power
- PC/IT: Power Supply, UPS System
Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
Mechanical Properties
Material
AIN

Dimensions
190*138mm
Customizable
Thickness
0.635mm
Customizable
Density
3.3g/cm3

Surface Roughness
Ra≤1.5um; Rz≤10um
Grindable
Warp
≤200um

Wetability
≥95%

Flexural Strength
≥350MPa

Electrical Characteristics
Thermal conductivity
≥170W/m·k
Coefficient of thermal expansion
4.7(20~ 300℃)10-6/K
Dielectric loss
0.0005MHz
Dielectric constant
9MHz
Dielectric strength
≥20KV/mm
Resistivity
1014Ω.cm
Vias
Hole diameter
120~160um
Hole spacing
≥0.2mm
Positioning accuracy
±150um
Hole to metal edge distance
≥0mm
Hole to tile edge distance
≥1mm
Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
Copper Foil
Purity
≥99%
O2 content
OFHC
Hardness
80~110HV
Conductivity
98.3MS/m
Motherboard Performance
Total Tolerance
+0.2/-0.05mm
Copper Edge to Porcelain Edge
±0.15mm
Total Thickness
± 5%
Through Hole Diameter
±0.1mm
Maximum Active Area
99%
Paste Printing
Main ingredients
Cu Ag Ti
Thickness
10~50um
Effective printing area
99%
Surface Treatment
Coating
Ni layer thickness
2~10um
Ag layer thickness
0.03~ 1.0um
Au added layer thickness
0.01~0.2um
Solder Mask
Ink color
Green, black
Thickness
10um
Position accuracy
±150um
Dimensional accuracy
±100um
Heat resistance
300°C, 30 minutes, no peeling
Adhesion
3M tape test, no peeling
Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
Product Performance
Hot and cold cycle
(-40°C/air to 170°C/air)
≥1000 times (no delamination)
Void rate (ultrasonic scanning)
≤0.01% (200um resolution)
Pattern specifications and spacing
Copper plate thickness (mm)
Spacing (mm)
Minimum size (mm)
0.2
0.35
0.7
0.25
0.4
0.8
0.3
0.5
1
0.4
0.6
1.2
0.5
0.7
1.4
0.8
1
2
Tile margin
Copper plate thickness (mm)
Ceramic margin (mm)
0.2
A≥0.20
0.25
A≥0.25
0.3
A≥0.30
0.4
A≥0.40
0.5
A≥0.45
0.8
A≥0.50
Our Factory
Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
Packing & Delivery
Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
Electrical High-Conductivity Aluminum Nitride Aln Ceramic Amb Copper-Clad Substrate Metallized Ceramic Sheet for High-Power Modules
FAQ
Q: Are you trading company or manufacturer?
A: We are manufacturer.
Q: How long is your delivery time?
A: Generally within 30 working days, it is according to quantity.
Q: Do you provide samples? Is it free or extra?
A: The samples can be provided, but the shipping cost should be on buyer's account.
Q: What is your term of payment?
A: Payment<=10000 USD, 100% in advance. Payment>=10000 USD, 70% T/T in advance, balance before shipment.

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