High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Industry
Conductive Layer: Thick Copper Layer
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  • High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
  • High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
  • High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
  • High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
  • High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
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  • Overview
  • Product Description
  • Specification
  • Our Factory
  • Packing & Delivery
  • FAQ
Overview

Basic Info.

Model NO.
alummina nitride ceramic
Material
AlN
Process
Customizable
Thickness
Customizable
Colour
Gray
Density
≥3.33G/Cm³
Dielectric Constant
8~10MHz
Dielectric Strength
≥17 Kv/mm
Flexural Strength
≥450 MPa
Water Absorption
0%
Volume Resistivity
≥1013 Ω.Cm
Key Word
Aluminum Nitride Ceramic
Key Words
Aln Ceramic
Keyword
Alumina Nitride Ceramic Substrate
Keywords
Aln Ceramic Substrate
Transport Package
Wooden Box
Specification
Customizable
Trademark
OEM/ODM
Origin
China
HS Code
8547100000
Production Capacity
70000000/Month

Product Description

Product Description
Aluminum Nitride Ceramic Substrate
Aluminum nitride ceramics have excellent thermal conductivity (5-10 times that of alumina ceramics), low dielectric constant and dielectric loss, reliable insulation performance, excellent mechanical properties, high temperature resistance, chemical corrosion resistance, and a thermal expansion coefficient similar to that of silicon. As a new generation of ceramic materials, it is receiving more and more attention and attention. The aluminum nitride ceramics produced by our company are widely used in communication devices, high-brightness LEDs, power electronic devices and other industries.
High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
Specification
Item
Unit
Value
Test Standard
1)Colour
-
Gray
3.2
2)Density
g/cm³
≥3.33
GB/T 2413
3)Thermal Conductivity
20℃,W/(m·K)
≥170
GB/T 5598
4)Dielectric Constant
1MHz
8~10
GB/T 5594.4
5)Dielectric Strength
KV/mm
≥17
GB/T 5593
6)Flexural Strength
MPa
≥450
GB/T5593
7)Camber
Length%.
≤2%.
-
8)Surface roughness Ra
μm
0.3~0.6
GB/T 6062
9)Water absorption
%
0
GB/T 3299-1996
High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
Thickness
Specification
0.127~0.15
0.15~0.2
0.2~0.254
0.38
0.5
Aluminum nitride ceramic substrate specifications
50.8*50.8
50.8*50.8
50.8*50.8
50.8*50.8
50.8*50.8


76*76
76*76
76*76


101.6*101.6
101.6*101.6
101.6*101.6


114.3*114.3
110*110
110*110



114.3*114.3
114.3*114.3



120*120
120*120



127*127
127*127




140*190
Note: 1. Products with larger or smaller sizes, thinner or thicker thickness, and other products with special specifications can be      laser processed or customized according to customer requirements.
2. Please confirm with us the length and width tolerances of product specifications with shading before placing an order.
Thickness
Specification
0.635
1.0
1.5
2.0
Others
Aluminum nitride ceramic substrate specifications
50.8*50.8
50.8*50.8
50.8*50.8
101.6*101.6






76*76
76*76
76*76
114.3*114.3

101.6*101.6
101.6*101.6
101.6*101.6
127*127

110*110
110*110
110*110


114.3*114.3
114.3*114.3
114.3*114.3


120*120
120*120
120*120


127*127
127*127
127*127


140*190
132*132
132*132



140*190



Note: 1. Products with larger or smaller sizes, thinner or thicker thickness, and other products with special specifications can be laser processed or customized according to customer requirements.
2. Please confirm with us the length and width tolerances of product specifications with shading before placing an order.
Our Factory
High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
Packing & Delivery
High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
High Insulation Resistance 200W/Mk Thermal Conductivity Aluminum Nitride Aln Ceramic Substrate for 5g RF & IGBT Power Modules
FAQ
Q: Are you trading company or manufacturer?
A: We are manufacturer.
Q: How long is your delivery time?
A: Generally within 30 working days, it is according to quantity.
Q: Do you provide samples? Is it free or extra?
A: The samples can be provided, but the shipping cost should be on buyer's account.
Q: What is your term of payment?
A: Payment<=10000 USD, 100% in advance. Payment>=10000 USD, 70% T/T in advance, balance before shipment.

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