High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure

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Product Details
Customization: Available
Application: Electronic Devices, Power Supply, Semiconductors
Conductive Layer: Customizable
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High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure pictures & photos
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure pictures & photos
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure pictures & photos
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure pictures & photos
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure pictures & photos
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure pictures & photos
  • High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
  • High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
  • High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
  • High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
  • High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
  • High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure

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Overview

Basic Info.

Model NO.
AMB ceramic substrate
Material
Al2O3
Process
Customizable
Thickness
Customizable
Density
3.7g/Cm³
Warp
≤200um
Wetability
≥95%
Flexural Strength
≥330/350/700MPa
Thermal Conductivity
23W /M·K
Dielectric Constant
9 MHz
Dielectric Strength
≥20kv/mm
Hole Diameter
120~ 160um
Hole Spacing
≥0.2mm
Positioning Accuracy
±150um
Hole to Metal Edge Distance
≥0mm
Hole to Tile Edge Distance
≥1mm
Main Ingredients
Cu AG Ti
Transport Package
Wooden Box
Specification
Customizable
Trademark
OEM/ODM
Origin
China

Product Description

Product Description
Thick-film Substrates on Ceramic Surfaces
Ceramic surface metallization is a process that creates a uniform metal coating on a ceramic substrate. Its primary purpose is to enhance the ceramic material's properties, including electrical conductivity, mechanical strength, and corrosion resistance. Thick-film metallization technology involves depositing conductive and functional layers onto the ceramic surface, creating components that combine the inherent properties of ceramic with the enhanced functionality of metallization.
Thick-film substrates are primarily used in low-cost, low- to medium-power applications, such as consumer electronics, sensors, and resistor networks.
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
Applied Area
- Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control   Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors 
- Home Appliance: Air Conditioner, Peltier Cooler 
- Industrial: LED Displays, Welding Machine
- Aerospace: Laser, Power Supply for Satellites and Aircrafts 
- Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power
- PC/IT: Power Supply, UPS System
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
Mechanical Properties
Material
AIO(96 99 ZTA)
AIN
SiN

Dimensions
50*50mm
50*50mm
50*50mm
Customizable
Thickness
0.635mm
1.0mm
0.32mm
Customizable
Density
≥3.7g/cm3
≥3.3g/cm3
≥3.2±0.25 g/cm3

Surface Roughness
Ra≤1.5um; Rz≤10um
Grindable
Warp
≤200um

Wetability
≥ 95%

Flexural Strength
≥330MPa
≥350MPa
700~800MPa

Electrical Characteristics
Thermal conductivity
23W/m.k
230W/m.k
85W/m-k
Coefficient of thermal expansion
6.6~7.5(25~ 500℃)10-6/ K
4.7(20 ~ 300°℃)10-6/K
2.5(20~ 300℃)10-6/K
Dielectric loss
0.0003MHz
0.0005MHz
0.001MHz
Dielectric constant
9MHz
9MHz
8MHz
Dielectric strength
≥20KV/mm
≥20KV/mm
≥20KV/mm
Resistivity
1014Ω.cm
1014Ω.cm
1014Ω.cm
Vias
Hole diameter
120~160um
Hole spacing
≥0.2mm
Positioning accuracy
±150um
Hole to metal edge distance
≥0mm
Hole to tile edge distance
≥1mm
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
Cutting
Full cut
/
Can cut rounded corners
Pre-cut depth
30 ~ 80%

Accuracy
±50um

Conductivity
98.3MS/m

Product Performance
Hot and cold cycle (-40°C/air to 170°C/air)
≥1000 times (no delamination)
Void rate (ultrasonic scanning)
≤0.01% (200um resolution)
Paste Printing
Main ingredients
Cu Ag Ti
Thickness
10~50um
Effective printing area
99%
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
Surface Treatment
Plating (Ni Ag Au)
Ni layer thickness
2~10um
Ag layer thickness
0.03~ 1.0um
Au added layer thickness
0.01~ 0.2um
Solder Mask
Ink color
Green, black
Thickness
10um
Our Factory
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
Packing & Delivery
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure
FAQ
Q: Are you trading company or manufacturer?
A: We are manufacturer.
Q: How long is your delivery time?
A: Generally within 30 working days, it is according to quantity.
Q: Do you provide samples? Is it free or extra?
A: The samples can be provided, but the shipping cost should be on buyer's account.
Q: What is your term of payment?
A: Payment<=10000 USD, 100% in advance. Payment>=10000 USD, 70% T/T in advance, balance before shipment.

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